MediaTek plans to open a new design center in the US with $1.4 million in government funding

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Taiwan’s MediaTek, the world’s fourth-largest chip designer by revenue, plans to set up a new design center in Indiana in partnership with Purdue University, the company told Reuters. MediaTek, which makes processors for many Android phones and smart speakers, declined to say how much it would invest in its first Midwest design hub, but said it received $1.4 million from the state (nearly Rs. 11 crore) for the center.

“Being in Indiana means we will have access to some of the best technical talent in the world,” said Dr. Kou-Hung Lawrence Loh, MediaTek I corporate senior vice president and MediaTek USA president, in a statement that the company plans to release later on Tuesday.

The company will seek to hire engineers from top schools in Indiana and nearby states that it would normally recruit at its design centers in California or the Northeast, it said.

MediaTek also said it plans to endow a professorship at Purdue to compete for federal research grants, a funding source that could see a big boost if a chip industry support bill is approved by Congress. The announcement comes after Taiwan’s GlobalWafers announced on Monday it will build a $5 billion (nearly Rs.39,500) silicon wafer fab in Sherman, Texas, as a global shortage of semiconductor chips continues to affect supply chains and some automobiles – and forcing electronics companies to scale back production.

In a related development, MediaTek Dimensity 9000+ was unveiled last week as the company’s latest smartphone system-on-chip (SoC). The new Dimensity chipset is said to deliver a five percent increase in CPU performance and a more than 10 percent improvement in GPU performance over the Dimensity 9000. The Dimensity 9000+ supports Full HD+ displays with up to 180 Hz and up to 320 megapixel cameras. It also includes support for the latest Wi-Fi and Bluetooth connectivity. The Dimensity 9000+ features an integrated 5G modem to support high-speed data access.

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